<?xml version="1.0" encoding="utf-8"?>
<journal>
<title>IRANIAN JOURNAL OF ELECTRICAL AND ELECTRONIC ENGINEERING</title>
<title_fa></title_fa>
<short_title>IJEEE</short_title>
<subject>Engineering &amp; Technology</subject>
<web_url>http://ijeee.iust.ac.ir</web_url>
<journal_hbi_system_id>18</journal_hbi_system_id>
<journal_hbi_system_user>agent2</journal_hbi_system_user>
<journal_id_issn>1735-2827</journal_id_issn>
<journal_id_issn_online>1735-2827</journal_id_issn_online>
<journal_id_pii></journal_id_pii>
<journal_id_doi></journal_id_doi>
<journal_id_iranmedex></journal_id_iranmedex>
<journal_id_magiran></journal_id_magiran>
<journal_id_sid></journal_id_sid>
<journal_id_nlai></journal_id_nlai>
<journal_id_science></journal_id_science>
<language>en</language>
<pubdate>
	<type>jalali</type>
	<year>1404</year>
	<month>3</month>
	<day>1</day>
</pubdate>
<pubdate>
	<type>gregorian</type>
	<year>2025</year>
	<month>6</month>
	<day>1</day>
</pubdate>
<volume>21</volume>
<number>2</number>
<publish_type>online</publish_type>
<publish_edition>1</publish_edition>
<article_type>fulltext</article_type>
<articleset>
	<article>


	<language>en</language>
	<article_id_doi></article_id_doi>
	<title_fa></title_fa>
	<title>Vacuum-based Robotic Gripper using Vacuum Generator and Soft Suction Cup for Pick-and-Place of Electronic PCB Boards</title>
	<subject_fa>Mechatronics</subject_fa>
	<subject>Mechatronics</subject>
	<content_type_fa>Only For Articles of ELECRiS 2024</content_type_fa>
	<content_type>Only For Articles of ELECRiS 2024</content_type>
	<abstract_fa></abstract_fa>
	<abstract>&lt;span style=&quot;font-size:10.0pt&quot;&gt;&lt;span new=&quot;&quot; roman=&quot;&quot; style=&quot;font-family:&quot; times=&quot;&quot;&gt;The automation of Printed Circuit Board (PCB) assembly using robotic arms is increasingly essential in the electronics manufacturing industry, driven by the need for high precision and efficiency. A significant challenge in this process is the delicate handling and accurate placement of various types of PCB boards, such as SATA M.2, mSATA, and SATA Slim. This research aims to design and evaluate a vacuum-based robotic gripper using a vacuum generator and soft suction cup for the pick-and-place operations of electronic PCB boards. The methodology involves the design, fabrication, and experimental testing of the vacuum gripper, analyzing its performance across different feed pressures and vacuum levels. The principal results show that the vacuum gripper is highly effective in securely handling different PCB types, with success rates improving significantly at higher feed pressures, particularly at 0.3 MPa &lt;/span&gt;&lt;/span&gt;&lt;span style=&quot;font-size:10.0pt&quot;&gt;&lt;span new=&quot;&quot; roman=&quot;&quot; style=&quot;font-family:&quot; times=&quot;&quot;&gt;where all three PCB types attained perfect success rates of 100%.&lt;/span&gt;&lt;/span&gt; &lt;span style=&quot;font-size:10.0pt&quot;&gt;&lt;span new=&quot;&quot; roman=&quot;&quot; style=&quot;font-family:&quot; times=&quot;&quot;&gt;Specifically, the vacuum flow rates at a vacuum level of 80 kPa were 0.0010 NL/s, 0.002 NL/s, and 0.0030 NL/s for feed pressures of 0.1 MPa, 0.2 MPa, and 0.3 MPa, respectively. These findings confirm the vacuum gripper&amp;#39;s capability to enhance automation in PCB assembly, offering a scalable and adaptable solution that meets the industry&amp;#39;s demands for precision, efficiency, and reliability. Overall, the vacuum gripper demonstrated a 100% success rate for all tested PCB types at optimal feed pressure, significantly improving. &lt;/span&gt;&lt;/span&gt;&lt;span style=&quot;font-size:10.0pt&quot;&gt;&lt;span new=&quot;&quot; roman=&quot;&quot; style=&quot;font-family:&quot; times=&quot;&quot;&gt;This study provides a foundation for future improvements in robotic handling systems for delicate electronic components.&lt;/span&gt;&lt;/span&gt;</abstract>
	<keyword_fa></keyword_fa>
	<keyword>Vacuum-based robotic gripper, PCB assembly automation, pick-and-place operations, electronic components handling.</keyword>
	<start_page>16</start_page>
	<end_page>26</end_page>
	<web_url>http://ijeee.iust.ac.ir/browse.php?a_code=A-10-5460-4&amp;slc_lang=en&amp;sid=1</web_url>


<author_list>
	<author>
	<first_name>Muhammad Syafiq</first_name>
	<middle_name></middle_name>
	<last_name>Sheik Azmi</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>muhammadsyafiq@studentmail.unimap.edu.my</email>
	<code>1800319475328460016446</code>
	<orcid>1800319475328460016446</orcid>
	<coreauthor>No</coreauthor>
	<affiliation>Faculty of Electrical Engineering &amp; Technology, Universiti Malaysia Perlis, Malaysia.</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


	<author>
	<first_name>Muhamad Hisyam</first_name>
	<middle_name></middle_name>
	<last_name>Rosle</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>m.hisyam@utm.my</email>
	<code>1800319475328460016447</code>
	<orcid>1800319475328460016447</orcid>
	<coreauthor>No</coreauthor>
	<affiliation>Department of Mechanical Precision Engineering, Malaysia-Japan International Institute of Technology, Malaysia.</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


	<author>
	<first_name>Muhammad Nazrin Shah</first_name>
	<middle_name></middle_name>
	<last_name>Shahrol Aman</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>nazrinshahrol@unimap.edu.my</email>
	<code>1800319475328460016448</code>
	<orcid>1800319475328460016448</orcid>
	<coreauthor>Yes
</coreauthor>
	<affiliation>Faculty of Electrical Engineering &amp; Technology, Universiti Malaysia Perlis, Malaysia.</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


	<author>
	<first_name>Ali Akbar</first_name>
	<middle_name></middle_name>
	<last_name>Abd Aziz</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>abdaziz.aliakhbar@smartm.com</email>
	<code>1800319475328460016449</code>
	<orcid>1800319475328460016449</orcid>
	<coreauthor>No</coreauthor>
	<affiliation>Department of Engineering, SMART Modular Technologies Sdn Bhd, Malaysia.</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


	<author>
	<first_name>Chandran</first_name>
	<middle_name></middle_name>
	<last_name>Tetegre</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>chandran.tategre@smartm.com</email>
	<code>1800319475328460016450</code>
	<orcid>1800319475328460016450</orcid>
	<coreauthor>No</coreauthor>
	<affiliation>Department of Engineering, SMART Modular Technologies Sdn Bhd, Malaysia.</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


</author_list>


	</article>
</articleset>
</journal>
